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Specializing in LTCC & Thickfilm Products

Next Generation Technology, Engineered Today


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Dupont, Ferro, Heraeus and ZST  LTCC Systems
Inspection to Mil-Std 883
Buried Resisors to +/- 30%
Zero Shrink Technology
Qualification Testing to Mil-PRF-38534
Quick Turn Prototyping
All Gold and Mixed Metal Systems
Product Design and Development
Integrated Package Assembly
Integrated Passives
Ceramic Sawing and Green Cutting
Electroless Plating of TF Conductors
Laser Resistor Trimming
Ceramic Laser Machining
Ceramic Lapping
Ceramic Polishing