 |
Dupont, Ferro, Heraeus
and ZST LTCC Systems |
|
|
Inspection to Mil-Std
883 |
|
|
Buried Resisors to +/-
30% |
|
|
|
|
|
Zero Shrink Technology |
|
|
Qualification Testing
to Mil-PRF-38534 |
|
|
Quick Turn Prototyping |
|
|
|
|
|
All Gold and Mixed
Metal Systems |
|
|
Product Design and
Development |
|
|
Integrated Package
Assembly |
|
|
|
|
|
Integrated Passives |
|
|
Ceramic Sawing and
Green Cutting |
|
|
Electroless Plating of
TF Conductors |
|
|
|
|
|
Laser Resistor
Trimming |
|
|
Ceramic Laser
Machining |
|
|
|
|
|
|
Ceramic Lapping |
|
|
Ceramic Polishing |
|
|
|
|
|
